Resicure 2-MI

Used as a sole curing agent or as a DICY and anhydride cure accelerator in epoxy resin based formulations.

Loading levels as sole curing agent: 3-5 phr

Loading levels as accelerator: .5-1.5 phr

Used in 1k adhesives, composites, electrical potting and powder coatings.

Category: Brand:

Description

2 methyl imidazole

CAS # 693-98-1

yellow to white micronized powder

Avg particle size: < 10 microns

Melt pt: 140-145 C

Moisture content: <. 5%

 

Additional information

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