rheology

  • PANSIL 400 is a polyfunctional additive, supplied as a fine powder manufactured from sepiolite. It is an excellent suspension aid and active filler with an outstanding efficiency/cost ratio.

    Properties

    PANSIL 400, due to its high surface activity produces an increase in system component distribution favouring the increase of immature resistance and keeping stability after high temperature curing. PANSIL 400 improves polymer, filler, organic and inorganic fibre distribution.

    Fields of application

    • Asphalt sheets.
    • Conglomerating in molecular sieves.
    • Seed coating.
    • Asphalt emulsions.
  • Fumed silica rheology additive, treated Applications
    • Synthetic rubbers and Silicone rubbers: Reinforcing effect , Electrical insulation
    • Sealants: Thickening and thixotropy, Reinforcement, improved adhesion
    • Unsaturated polyester resins: Thickening and thixotropy
    • Paints / Coatings: Thickening and thixotropy, Storage stability (resistance to settlement)
    • Adhesives: Thickening and thixotropy, improved adhesion Storage stability (resistance to settlement)
    • Paper: Adsorbent, Transparency
    • Bulk materials: Anti-caking, free flow aids , Adsorbent, Anti-blocking effect, moisture resistance
    • CMP: Polishing agent
    • Toners: Improved flow properties, electric charge control, Improved toner transfer to paper
    Characteristics Thickening and thixotropy: REOLOSIL provides thickening and thixotropic effects in liquid systems such as polyesters, epoxies, and urethane resins due to interactions between aggregates and the development of three-dimensional networks between REOLOSIL particles. Reinforcement: Adding REOLOSIL as a filler material improves various mechanical properties of elastomers, including modulus, elongation at break, tensile strength and tear resistance. REOLOSIL's large specific surface area also makes it possible to achieve excellent transparency in elastomers. Anti-settling effects: REOLOSIL improves the suspension behavior in liquid systems, such as pigmented coatings or resins containing filters. Anti-caking, effects for Improved flow characteristics: Due to a property that makes it behave like bait bearings, REOLOSIL resists lumping and clogging. It can be used to improve the storage stability of powders that are especially prone to caking. REOLOSIL can also be used to improve flow characteristics and prevent flow problems. Insulation: With its very low solid state conductivity and vast spacing between particles, REOLOSIL provides excellent electrical and thermal insulation properties. Electrical charge: Hydrophobic REOLOSIL is used as a toner additive to stabilize electrical charge characteristics. TOKUYAMA can provide hydrophobic REOLOSIL grades manufactured to custom specifications. Polishing: In the semiconductor manufacturing process, the planarizalion of silicon wafers is achieved via CMP (chemical mechanical polishing) processes such as ILD, STI and metal CMP. REOLOSIL is used in certain CMP slurries as a polishing agent, due to high purity, sub-micron particle size and its distribution characteristics.      
  • Fumed silica, treated, rheology additive Applications
    • Synthetic rubbers and Silicone rubbers: Reinforcing effect , Electrical insulation
    • Sealants: Thickening and thixotropy, Reinforcement, improved adhesion
    • Unsaturated polyester resins: Thickening and thixotropy
    • Paints / Coatings: Thickening and thixotropy, Storage stability (resistance to settlement)
    • Adhesives: Thickening and thixotropy, improved adhesion Storage stability (resistance to settlement)
    • Paper: Adsorbent, Transparency
    • Bulk materials: Anti-caking, free flow aids , Adsorbent, Anti-blocking effect, moisture resistance
    • CMP: Polishing agent
    • Toners: Improved flow properties, electric charge control, Improved toner transfer to paper
    Characteristics Thickening and thixotropy: REOLOSIL provides thickening and thixotropic effects in liquid systems such as polyesters, epoxies, and urethane resins due to interactions between aggregates and the development of three-dimensional networks between REOLOSIL particles. Reinforcement: Adding REOLOSIL as a filler material improves various mechanical properties of elastomers, including modulus, elongation at break, tensile strength and tear resistance. REOLOSIL's large specific surface area also makes it possible to achieve excellent transparency in elastomers. Anti-settling effects: REOLOSIL improves the suspension behavior in liquid systems, such as pigmented coatings or resins containing filters. Anti-caking, effects for Improved flow characteristics: Due to a property that makes it behave like bait bearings, REOLOSIL resists lumping and clogging. It can be used to improve the storage stability of powders that are especially prone to caking. REOLOSIL can also be used to improve flow characteristics and prevent flow problems. Insulation: With its very low solid state conductivity and vast spacing between particles, REOLOSIL provides excellent electrical and thermal insulation properties. Electrical charge: Hydrophobic REOLOSIL is used as a toner additive to stabilize electrical charge characteristics. TOKUYAMA can provide hydrophobic REOLOSIL grades manufactured to custom specifications. Polishing: In the semiconductor manufacturing process, the planarizalion of silicon wafers is achieved via CMP (chemical mechanical polishing) processes such as ILD, STI and metal CMP. REOLOSIL is used in certain CMP slurries as a polishing agent, due to high purity, sub-micron particle size and its distribution characteristics.    
  • Fumed silica rheology additive Applications
    • Synthetic rubbers and Silicone rubbers: Reinforcing effect , Electrical insulation
    • Sealants: Thickening and thixotropy, Reinforcement, improved adhesion
    • Unsaturated polyester resins: Thickening and thixotropy
    • Paints / Coatings: Thickening and thixotropy, Storage stability (resistance to settlement)
    • Adhesives: Thickening and thixotropy, improved adhesion Storage stability (resistance to settlement)
    • Paper: Adsorbent, Transparency
    • Bulk materials: Anti-caking, free flow aids , Adsorbent, Anti-blocking effect, moisture resistance
    • CMP: Polishing agent
    • Toners: Improved flow properties, electric charge control, Improved toner transfer to paper
    Characteristics Thickening and thixotropy: REOLOSIL provides thickening and thixotropic effects in liquid systems such as polyesters, epoxies, and urethane resins due to interactions between aggregates and the development of three-dimensional networks between REOLOSIL particles. Reinforcement: Adding REOLOSIL as a filler material improves various mechanical properties of elastomers, including modulus, elongation at break, tensile strength and tear resistance. REOLOSIL's large specific surface area also makes it possible to achieve excellent transparency in elastomers. Anti-settling effects: REOLOSIL improves the suspension behavior in liquid systems, such as pigmented coatings or resins containing filters. Anti-caking, effects for Improved flow characteristics: Due to a property that makes it behave like bait bearings, REOLOSIL resists lumping and clogging. It can be used to improve the storage stability of powders that are especially prone to caking. REOLOSIL can also be used to improve flow characteristics and prevent flow problems. Insulation: With its very low solid state conductivity and vast spacing between particles, REOLOSIL provides excellent electrical and thermal insulation properties. Electrical charge: Hydrophobic REOLOSIL is used as a toner additive to stabilize electrical charge characteristics. TOKUYAMA can provide hydrophobic REOLOSIL grades manufactured to custom specifications. Polishing: In the semiconductor manufacturing process, the planarizalion of silicon wafers is achieved via CMP (chemical mechanical polishing) processes such as ILD, STI and metal CMP. REOLOSIL is used in certain CMP slurries as a polishing agent, due to high purity, sub-micron particle size and its distribution characteristics.    
  • Fumed silica, untreated Applications
    • Synthetic rubbers and Silicone rubbers: Reinforcing effect , Electrical insulation
    • Sealants: Thickening and thixotropy, Reinforcement, improved adhesion
    • Unsaturated polyester resins: Thickening and thixotropy
    • Paints / Coatings: Thickening and thixotropy, Storage stability (resistance to settlement)
    • Adhesives: Thickening and thixotropy, improved adhesion Storage stability (resistance to settlement)
    • Paper: Adsorbent, Transparency
    • Bulk materials: Anti-caking, free flow aids , Adsorbent, Anti-blocking effect, moisture resistance
    • CMP: Polishing agent
    • Toners: Improved flow properties, electric charge control, Improved toner transfer to paper
    Characteristics Thickening and thixotropy: REOLOSIL provides thickening and thixotropic effects in liquid systems such as polyesters, epoxies, and urethane resins due to interactions between aggregates and the development of three-dimensional networks between REOLOSIL particles. Reinforcement: Adding REOLOSIL as a filler material improves various mechanical properties of elastomers, including modulus, elongation at break, tensile strength and tear resistance. REOLOSIL's large specific surface area also makes it possible to achieve excellent transparency in elastomers. Anti-settling effects: REOLOSIL improves the suspension behavior in liquid systems, such as pigmented coatings or resins containing filters. Anti-caking, effects for Improved flow characteristics: Due to a property that makes it behave like bait bearings, REOLOSIL resists lumping and clogging. It can be used to improve the storage stability of powders that are especially prone to caking. REOLOSIL can also be used to improve flow characteristics and prevent flow problems. Insulation: With its very low solid state conductivity and vast spacing between particles, REOLOSIL provides excellent electrical and thermal insulation properties. Electrical charge: Hydrophobic REOLOSIL is used as a toner additive to stabilize electrical charge characteristics. TOKUYAMA can provide hydrophobic REOLOSIL grades manufactured to custom specifications. Polishing: In the semiconductor manufacturing process, the planarizalion of silicon wafers is achieved via CMP (chemical mechanical polishing) processes such as ILD, STI and metal CMP. REOLOSIL is used in certain CMP slurries as a polishing agent, due to high purity, sub-micron particle size and its distribution characteristics.    
  • Fumed silica untreated Applications
    • Synthetic rubbers and Silicone rubbers: Reinforcing effect , Electrical insulation
    • Sealants: Thickening and thixotropy, Reinforcement, improved adhesion
    • Unsaturated polyester resins: Thickening and thixotropy
    • Paints / Coatings: Thickening and thixotropy, Storage stability (resistance to settlement)
    • Adhesives: Thickening and thixotropy, improved adhesion Storage stability (resistance to settlement)
    • Paper: Adsorbent, Transparency
    • Bulk materials: Anti-caking, free flow aids , Adsorbent, Anti-blocking effect, moisture resistance
    • CMP: Polishing agent
    • Toners: Improved flow properties, electric charge control, Improved toner transfer to paper
    Characteristics Thickening and thixotropy: REOLOSIL provides thickening and thixotropic effects in liquid systems such as polyesters, epoxies, and urethane resins due to interactions between aggregates and the development of three-dimensional networks between REOLOSIL particles. Reinforcement: Adding REOLOSIL as a filler material improves various mechanical properties of elastomers, including modulus, elongation at break, tensile strength and tear resistance. REOLOSIL's large specific surface area also makes it possible to achieve excellent transparency in elastomers. Anti-settling effects: REOLOSIL improves the suspension behavior in liquid systems, such as pigmented coatings or resins containing filters. Anti-caking, effects for Improved flow characteristics: Due to a property that makes it behave like bait bearings, REOLOSIL resists lumping and clogging. It can be used to improve the storage stability of powders that are especially prone to caking. REOLOSIL can also be used to improve flow characteristics and prevent flow problems. Insulation: With its very low solid state conductivity and vast spacing between particles, REOLOSIL provides excellent electrical and thermal insulation properties. Electrical charge: Hydrophobic REOLOSIL is used as a toner additive to stabilize electrical charge characteristics. TOKUYAMA can provide hydrophobic REOLOSIL grades manufactured to custom specifications. Polishing: In the semiconductor manufacturing process, the planarizalion of silicon wafers is achieved via CMP (chemical mechanical polishing) processes such as ILD, STI and metal CMP. REOLOSIL is used in certain CMP slurries as a polishing agent, due to high purity, sub-micron particle size and its distribution characteristics.    
  • Fumed silica matting agent Applications
    • Synthetic rubbers and Silicone rubbers: Reinforcing effect , Electrical insulation
    • Sealants: Thickening and thixotropy, Reinforcement, improved adhesion
    • Unsaturated polyester resins: Thickening and thixotropy
    • Paints / Coatings: Thickening and thixotropy, Storage stability (resistance to settlement)
    • Adhesives: Thickening and thixotropy, improved adhesion Storage stability (resistance to settlement)
    • Paper: Adsorbent, Transparency
    • Bulk materials: Anti-caking, free flow aids , Adsorbent, Anti-blocking effect, moisture resistance
    • CMP: Polishing agent
    • Toners: Improved flow properties, electric charge control, Improved toner transfer to paper
    Characteristics Thickening and thixotropy: REOLOSIL provides thickening and thixotropic effects in liquid systems such as polyesters, epoxies, and urethane resins due to interactions between aggregates and the development of three-dimensional networks between REOLOSIL particles. Reinforcement: Adding REOLOSIL as a filler material improves various mechanical properties of elastomers, including modulus, elongation at break, tensile strength and tear resistance. REOLOSIL's large specific surface area also makes it possible to achieve excellent transparency in elastomers. Anti-settling effects: REOLOSIL improves the suspension behavior in liquid systems, such as pigmented coatings or resins containing filters. Anti-caking, effects for Improved flow characteristics: Due to a property that makes it behave like bait bearings, REOLOSIL resists lumping and clogging. It can be used to improve the storage stability of powders that are especially prone to caking. REOLOSIL can also be used to improve flow characteristics and prevent flow problems. Insulation: With its very low solid state conductivity and vast spacing between particles, REOLOSIL provides excellent electrical and thermal insulation properties. Electrical charge: Hydrophobic REOLOSIL is used as a toner additive to stabilize electrical charge characteristics. TOKUYAMA can provide hydrophobic REOLOSIL grades manufactured to custom specifications. Polishing: In the semiconductor manufacturing process, the planarizalion of silicon wafers is achieved via CMP (chemical mechanical polishing) processes such as ILD, STI and metal CMP. REOLOSIL is used in certain CMP slurries as a polishing agent, due to high purity, sub-micron particle size and its distribution characteristics.    
  • Anionic inverse emulsion thickener. Imparts a long stringy flow to a wide variety of aqueous and non-aqueous compositions and is effective over a wide pH range. Low viscosity liquid which gives instantaneous thickening on direct mixing into the composition. The polymer is already in solution (as the sodium salt) and does not require any other additives to promote thickening e.g. alkali, surfactant etc. APEO free.
  • An inverse emulsion thickener which imparts a short flow to a wide variety of aqueous and non-aqueous compositions and is effective over a wide pH range. Low viscosity liquid which instantaneous thickening effect on direct mixing into a composition. The polymer in is already in solution (as the sodium salt) and requiring no additional additives to promote thickening e.g. alkali, surfactant etc. APEO free.
  • Inverse emulsion thickener designed specifically for pigment printing.
  • Inverse emulsion thickener imparting very short flow to a wide variety of aqueous and non-aqueous compositions and is effective over a broad pH range with nearly instantaneous thickening.
  • An anionic inverse emulsion thickener which imparts an extremely short flow to a wide variety of aqueous and non-aqueous compositions and is effective over a wide pH range. Supplied as an easy to use, low viscosity liquid which gives an instantaneous thickening effect on direct mixing into the composition. The polymer in is already in solution (as the ammonium salt) and not requiring any other additives to promote thickening e.g. alkali, surfactant etc. APEO free.