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Solvent based

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    TYTAN™ CA 2E

    Tytan CA 2E is a formulated catalyst suitable for ethylene dimerization process for high purity 1-butene production. The liquid phase catalyst could avoid isomerization of 1-butene to 2-butene.
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    TYTAN™ BIP

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    TYTAN™ AP310

    Tytan AP310 is an ethyl citrate titanium complex that can be used as an adhesion promoter for printing, crosslinker for paints and as a catalyst for esterification. Due to its chelated structure, Tytan AP310 shows delayed reaction at ambient temperature and thus facilitates storage stability of inks.
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    TYTAN™ AP20

    Tytan AP20 is primarily designed to strongly increase adhesion of solvent based inks to a variety of plastics used for food packaging or other purposes, but also pigment distribution and heat sealing resistance are improved allowing perfect hiding power and appearance of printing on otherwise problematic substrates. Tytan AP20 however is more user-friendly as the addition of the ethanol strongly reduces the pour point and as such the possibility for crystallization at low to normal temperatures. Tytan AP20 can only be used in solvent based inks and coatings.
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    TYTAN™ AP-110

    Tytan AP110 is modified from Tytan AP100, which is aiming for better compatibility with various ink formulations. Tytan AP110 is proved offering the same adhesion performance as Tytan AP100, in addition, preventing the viscosity changed during printing process.
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    TYTAN™ AP-100

    Tytan AP100 is a Titanium Phosphate Complex of which the alkoxy groups can react with resins to promote adhesion and/or cross-linking while the chelating agents stabilize the molecule. Tytan AP100 is mainly designed to strongly increase adhesion of solvent based inks to a variety of plastics used for food packaging or other purposes. Tytan AP100 is transparent and therefore most suitable for modification of ink for very clear-colour and high-gloss printing. Tytan AP100 is low odour and applies to the most stringent contemporary legislation on registration of the ECB. Tytan AP100 can only be used in solvent based inks.
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    TYTAN™ AP 910

    Tytan AP910D is an ethyl citrate zirconium that can be used as an adhesion promoter for printing, crosslinker for paints and as a catalyst for esterification. Due to its chelated structure, Tytan AP910D shows delayed reaction at ambient temperature and thus facilitates storage stability of inks. Compared with organo-titanate adhesion promoters, it shows good compatibility with PVB, CAB and CAP inks and provides minimal discoloration during the sterilizing process in the printing of milk pouches. As the temperature increases above 60oC, the zirconate can interact with functional groups such as -OH, -COOH, -NH2 in the polymer or substrate.
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    TYTAN™ AP 110

    Tytan AP110 is modified from Tytan AP100, which is aiming for better compatibility with various ink formulations. Tytan AP110 is proved offering the same adhesion performance as Tytan AP100, in addition, preventing the viscosity changed during printing process.
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    Reolosil QS-40

    Fumed silica matting agent Applications
    • Synthetic rubbers and Silicone rubbers: Reinforcing effect , Electrical insulation
    • Sealants: Thickening and thixotropy, Reinforcement, improved adhesion
    • Unsaturated polyester resins: Thickening and thixotropy
    • Paints / Coatings: Thickening and thixotropy, Storage stability (resistance to settlement)
    • Adhesives: Thickening and thixotropy, improved adhesion Storage stability (resistance to settlement)
    • Paper: Adsorbent, Transparency
    • Bulk materials: Anti-caking, free flow aids , Adsorbent, Anti-blocking effect, moisture resistance
    • CMP: Polishing agent
    • Toners: Improved flow properties, electric charge control, Improved toner transfer to paper
    Characteristics Thickening and thixotropy: REOLOSIL provides thickening and thixotropic effects in liquid systems such as polyesters, epoxies, and urethane resins due to interactions between aggregates and the development of three-dimensional networks between REOLOSIL particles. Reinforcement: Adding REOLOSIL as a filler material improves various mechanical properties of elastomers, including modulus, elongation at break, tensile strength and tear resistance. REOLOSIL's large specific surface area also makes it possible to achieve excellent transparency in elastomers. Anti-settling effects: REOLOSIL improves the suspension behavior in liquid systems, such as pigmented coatings or resins containing filters. Anti-caking, effects for Improved flow characteristics: Due to a property that makes it behave like bait bearings, REOLOSIL resists lumping and clogging. It can be used to improve the storage stability of powders that are especially prone to caking. REOLOSIL can also be used to improve flow characteristics and prevent flow problems. Insulation: With its very low solid state conductivity and vast spacing between particles, REOLOSIL provides excellent electrical and thermal insulation properties. Electrical charge: Hydrophobic REOLOSIL is used as a toner additive to stabilize electrical charge characteristics. TOKUYAMA can provide hydrophobic REOLOSIL grades manufactured to custom specifications. Polishing: In the semiconductor manufacturing process, the planarizalion of silicon wafers is achieved via CMP (chemical mechanical polishing) processes such as ILD, STI and metal CMP. REOLOSIL is used in certain CMP slurries as a polishing agent, due to high purity, sub-micron particle size and its distribution characteristics.    
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    Reolosil QS-30

    Fumed silica untreated Applications
    • Synthetic rubbers and Silicone rubbers: Reinforcing effect , Electrical insulation
    • Sealants: Thickening and thixotropy, Reinforcement, improved adhesion
    • Unsaturated polyester resins: Thickening and thixotropy
    • Paints / Coatings: Thickening and thixotropy, Storage stability (resistance to settlement)
    • Adhesives: Thickening and thixotropy, improved adhesion Storage stability (resistance to settlement)
    • Paper: Adsorbent, Transparency
    • Bulk materials: Anti-caking, free flow aids , Adsorbent, Anti-blocking effect, moisture resistance
    • CMP: Polishing agent
    • Toners: Improved flow properties, electric charge control, Improved toner transfer to paper
    Characteristics Thickening and thixotropy: REOLOSIL provides thickening and thixotropic effects in liquid systems such as polyesters, epoxies, and urethane resins due to interactions between aggregates and the development of three-dimensional networks between REOLOSIL particles. Reinforcement: Adding REOLOSIL as a filler material improves various mechanical properties of elastomers, including modulus, elongation at break, tensile strength and tear resistance. REOLOSIL's large specific surface area also makes it possible to achieve excellent transparency in elastomers. Anti-settling effects: REOLOSIL improves the suspension behavior in liquid systems, such as pigmented coatings or resins containing filters. Anti-caking, effects for Improved flow characteristics: Due to a property that makes it behave like bait bearings, REOLOSIL resists lumping and clogging. It can be used to improve the storage stability of powders that are especially prone to caking. REOLOSIL can also be used to improve flow characteristics and prevent flow problems. Insulation: With its very low solid state conductivity and vast spacing between particles, REOLOSIL provides excellent electrical and thermal insulation properties. Electrical charge: Hydrophobic REOLOSIL is used as a toner additive to stabilize electrical charge characteristics. TOKUYAMA can provide hydrophobic REOLOSIL grades manufactured to custom specifications. Polishing: In the semiconductor manufacturing process, the planarizalion of silicon wafers is achieved via CMP (chemical mechanical polishing) processes such as ILD, STI and metal CMP. REOLOSIL is used in certain CMP slurries as a polishing agent, due to high purity, sub-micron particle size and its distribution characteristics.    
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    Reolosil QS-20

    Fumed silica, untreated Applications
    • Synthetic rubbers and Silicone rubbers: Reinforcing effect , Electrical insulation
    • Sealants: Thickening and thixotropy, Reinforcement, improved adhesion
    • Unsaturated polyester resins: Thickening and thixotropy
    • Paints / Coatings: Thickening and thixotropy, Storage stability (resistance to settlement)
    • Adhesives: Thickening and thixotropy, improved adhesion Storage stability (resistance to settlement)
    • Paper: Adsorbent, Transparency
    • Bulk materials: Anti-caking, free flow aids , Adsorbent, Anti-blocking effect, moisture resistance
    • CMP: Polishing agent
    • Toners: Improved flow properties, electric charge control, Improved toner transfer to paper
    Characteristics Thickening and thixotropy: REOLOSIL provides thickening and thixotropic effects in liquid systems such as polyesters, epoxies, and urethane resins due to interactions between aggregates and the development of three-dimensional networks between REOLOSIL particles. Reinforcement: Adding REOLOSIL as a filler material improves various mechanical properties of elastomers, including modulus, elongation at break, tensile strength and tear resistance. REOLOSIL's large specific surface area also makes it possible to achieve excellent transparency in elastomers. Anti-settling effects: REOLOSIL improves the suspension behavior in liquid systems, such as pigmented coatings or resins containing filters. Anti-caking, effects for Improved flow characteristics: Due to a property that makes it behave like bait bearings, REOLOSIL resists lumping and clogging. It can be used to improve the storage stability of powders that are especially prone to caking. REOLOSIL can also be used to improve flow characteristics and prevent flow problems. Insulation: With its very low solid state conductivity and vast spacing between particles, REOLOSIL provides excellent electrical and thermal insulation properties. Electrical charge: Hydrophobic REOLOSIL is used as a toner additive to stabilize electrical charge characteristics. TOKUYAMA can provide hydrophobic REOLOSIL grades manufactured to custom specifications. Polishing: In the semiconductor manufacturing process, the planarizalion of silicon wafers is achieved via CMP (chemical mechanical polishing) processes such as ILD, STI and metal CMP. REOLOSIL is used in certain CMP slurries as a polishing agent, due to high purity, sub-micron particle size and its distribution characteristics.    
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    Reolosil QS 102

    Fumed silica rheology additive Applications
    • Synthetic rubbers and Silicone rubbers: Reinforcing effect , Electrical insulation
    • Sealants: Thickening and thixotropy, Reinforcement, improved adhesion
    • Unsaturated polyester resins: Thickening and thixotropy
    • Paints / Coatings: Thickening and thixotropy, Storage stability (resistance to settlement)
    • Adhesives: Thickening and thixotropy, improved adhesion Storage stability (resistance to settlement)
    • Paper: Adsorbent, Transparency
    • Bulk materials: Anti-caking, free flow aids , Adsorbent, Anti-blocking effect, moisture resistance
    • CMP: Polishing agent
    • Toners: Improved flow properties, electric charge control, Improved toner transfer to paper
    Characteristics Thickening and thixotropy: REOLOSIL provides thickening and thixotropic effects in liquid systems such as polyesters, epoxies, and urethane resins due to interactions between aggregates and the development of three-dimensional networks between REOLOSIL particles. Reinforcement: Adding REOLOSIL as a filler material improves various mechanical properties of elastomers, including modulus, elongation at break, tensile strength and tear resistance. REOLOSIL's large specific surface area also makes it possible to achieve excellent transparency in elastomers. Anti-settling effects: REOLOSIL improves the suspension behavior in liquid systems, such as pigmented coatings or resins containing filters. Anti-caking, effects for Improved flow characteristics: Due to a property that makes it behave like bait bearings, REOLOSIL resists lumping and clogging. It can be used to improve the storage stability of powders that are especially prone to caking. REOLOSIL can also be used to improve flow characteristics and prevent flow problems. Insulation: With its very low solid state conductivity and vast spacing between particles, REOLOSIL provides excellent electrical and thermal insulation properties. Electrical charge: Hydrophobic REOLOSIL is used as a toner additive to stabilize electrical charge characteristics. TOKUYAMA can provide hydrophobic REOLOSIL grades manufactured to custom specifications. Polishing: In the semiconductor manufacturing process, the planarizalion of silicon wafers is achieved via CMP (chemical mechanical polishing) processes such as ILD, STI and metal CMP. REOLOSIL is used in certain CMP slurries as a polishing agent, due to high purity, sub-micron particle size and its distribution characteristics.    

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