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Pangel B10

Pangel B-10 is a powdered additive with a high thickening and anti-settling capacity for intermediate-low polarity systems, particularly recommended for systems based on white spirit type solvents.

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PANGEL B5 is a powdered additive with a high thickening and anti-settling capacity for low polarity systems, particularly recommended for systems based on both aliphatic solvents and mineral or synthetic oils used as vehicle in liquid formulations.

Properties

PANGEL B5 is particularly recommended to provide thixotropic, suspension and sagging-resistance properties to systems based on both aliphatic type solvents and mineral or synthetic oils. PANGEL B5 shows high thickening capacity in low polarity systems without the use of a polar activator for its dispersion. Use of PANGEL B5 has the following advantages against other conventional additives:

Decrease of sedimentation
High thickening capacity
Does not require polar activator
High capacity for thikening inverted emulsions
Control of sagging and dripping while improves stability.

Fields of application

Oil based concentrated formulations
Formulations based in inverted emulsions

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Reolosil QS 102

Fumed silica rheology additive Applications

Synthetic rubbers and Silicone rubbers: Reinforcing effect , Electrical insulation
Sealants: Thickening and thixotropy, Reinforcement, improved adhesion
Unsaturated polyester resins: Thickening and thixotropy
Paints / Coatings: Thickening and thixotropy, Storage stability (resistance to settlement)
Adhesives: Thickening and thixotropy, improved adhesion Storage stability (resistance to settlement)
Paper: Adsorbent, Transparency
Bulk materials: Anti-caking, free flow aids , Adsorbent, Anti-blocking effect, moisture resistance
CMP: Polishing agent
Toners: Improved flow properties, electric charge control, Improved toner transfer to paper

Characteristics Thickening and thixotropy: REOLOSIL provides thickening and thixotropic effects in liquid systems such as polyesters, epoxies, and urethane resins due to interactions between aggregates and the development of three-dimensional networks between REOLOSIL particles. Reinforcement: Adding REOLOSIL as a filler material improves various mechanical properties of elastomers, including modulus, elongation at break, tensile strength and tear resistance. REOLOSIL's large specific surface area also makes it possible to achieve excellent transparency in elastomers. Anti-settling effects: REOLOSIL improves the suspension behavior in liquid systems, such as pigmented coatings or resins containing filters. Anti-caking, effects for Improved flow characteristics: Due to a property that makes it behave like bait bearings, REOLOSIL resists lumping and clogging. It can be used to improve the storage stability of powders that are especially prone to caking. REOLOSIL can also be used to improve flow characteristics and prevent flow problems. Insulation: With its very low solid state conductivity and vast spacing between particles, REOLOSIL provides excellent electrical and thermal insulation properties. Electrical charge: Hydrophobic REOLOSIL is used as a toner additive to stabilize electrical charge characteristics. TOKUYAMA can provide hydrophobic REOLOSIL grades manufactured to custom specifications. Polishing: In the semiconductor manufacturing process, the planarizalion of silicon wafers is achieved via CMP (chemical mechanical polishing) processes such as ILD, STI and metal CMP. REOLOSIL is used in certain CMP slurries as a polishing agent, due to high purity, sub-micron particle size and its distribution characteristics.

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Reolosil FM 22

D 50 11 microns surface area 250 m2/g pH 7.0

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Reolosil FM 30 flatting agent

Fumed silica matting agent Low gloss, good clarity

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TYTAN™ ZPN

Tytan ZPN is aqueous solution of ammonia zirconium lactate and is used in paint manufacture to improve gel strength, anti-sagging, paint structuring and levelling. Tytan ZPN shall be added at the last stage after formulated paint with typical level between 0.3 ~ 1.5%. Tytan ZPN works well in the surfactant stabilized paint as well as colloid stabilized paint.

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Pangel OMD2

PANGEL OMD2 is a rheological additive for medium to high polarity systems, based upon highly purified bentonite clay. PANGEL OMD2 can be used for alcohols, esters and glycols. Moderate polarity binders are also compatible.

Properties

PANGEL OMD2 is an easy-to-disperse self-activated organobentonite that is recommended for providing the following properties in solvent-borne systems:

Thixotropic and pseudoplastic effects.
Sag control.
Excellent levelling.
Prevents pigment from long-term storage settling.
No need of pregelling or the use of polar activators.

Fields of application

Use of PANGEL OMD2 as a rheological additive is recommended in the following applications:

Anti-corrosive paints.
Adhesives.
Industrial finishes.
Maintenance coatings.
Epoxy based coatings.
Paint removers.

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Reolosil DM 10

Fumed silica rheology additive, treated Applications

Synthetic rubbers and Silicone rubbers: Reinforcing effect , Electrical insulation
Sealants: Thickening and thixotropy, Reinforcement, improved adhesion
Unsaturated polyester resins: Thickening and thixotropy
Paints / Coatings: Thickening and thixotropy, Storage stability (resistance to settlement)
Adhesives: Thickening and thixotropy, improved adhesion Storage stability (resistance to settlement)
Paper: Adsorbent, Transparency
Bulk materials: Anti-caking, free flow aids , Adsorbent, Anti-blocking effect, moisture resistance
CMP: Polishing agent
Toners: Improved flow properties, electric charge control, Improved toner transfer to paper

Characteristics Thickening and thixotropy: REOLOSIL provides thickening and thixotropic effects in liquid systems such as polyesters, epoxies, and urethane resins due to interactions between aggregates and the development of three-dimensional networks between REOLOSIL particles. Reinforcement: Adding REOLOSIL as a filler material improves various mechanical properties of elastomers, including modulus, elongation at break, tensile strength and tear resistance. REOLOSIL's large specific surface area also makes it possible to achieve excellent transparency in elastomers. Anti-settling effects: REOLOSIL improves the suspension behavior in liquid systems, such as pigmented coatings or resins containing filters. Anti-caking, effects for Improved flow characteristics: Due to a property that makes it behave like bait bearings, REOLOSIL resists lumping and clogging. It can be used to improve the storage stability of powders that are especially prone to caking. REOLOSIL can also be used to improve flow characteristics and prevent flow problems. Insulation: With its very low solid state conductivity and vast spacing between particles, REOLOSIL provides excellent electrical and thermal insulation properties. Electrical charge: Hydrophobic REOLOSIL is used as a toner additive to stabilize electrical charge characteristics. TOKUYAMA can provide hydrophobic REOLOSIL grades manufactured to custom specifications. Polishing: In the semiconductor manufacturing process, the planarizalion of silicon wafers is achieved via CMP (chemical mechanical polishing) processes such as ILD, STI and metal CMP. REOLOSIL is used in certain CMP slurries as a polishing agent, due to high purity, sub-micron particle size and its distribution characteristics.

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Nyacol AL 20 SD

Alumina powder that is dispersible in water or ethylene glycol. For use in high temperature coating and as a binder

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Nyagraph expandable graphite series

bulk density: +/- .6 g/cm3 Specific gravity: 2.2 g/cm3 Color: black w/metallic sheen pH: 6-7 free water: < 1% 95-99% purity expansion temps 150 to 200 C

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Reolosil QS-20

Fumed silica, untreated Applications

Synthetic rubbers and Silicone rubbers: Reinforcing effect , Electrical insulation
Sealants: Thickening and thixotropy, Reinforcement, improved adhesion
Unsaturated polyester resins: Thickening and thixotropy
Paints / Coatings: Thickening and thixotropy, Storage stability (resistance to settlement)
Adhesives: Thickening and thixotropy, improved adhesion Storage stability (resistance to settlement)
Paper: Adsorbent, Transparency
Bulk materials: Anti-caking, free flow aids , Adsorbent, Anti-blocking effect, moisture resistance
CMP: Polishing agent
Toners: Improved flow properties, electric charge control, Improved toner transfer to paper

Characteristics Thickening and thixotropy: REOLOSIL provides thickening and thixotropic effects in liquid systems such as polyesters, epoxies, and urethane resins due to interactions between aggregates and the development of three-dimensional networks between REOLOSIL particles. Reinforcement: Adding REOLOSIL as a filler material improves various mechanical properties of elastomers, including modulus, elongation at break, tensile strength and tear resistance. REOLOSIL's large specific surface area also makes it possible to achieve excellent transparency in elastomers. Anti-settling effects: REOLOSIL improves the suspension behavior in liquid systems, such as pigmented coatings or resins containing filters. Anti-caking, effects for Improved flow characteristics: Due to a property that makes it behave like bait bearings, REOLOSIL resists lumping and clogging. It can be used to improve the storage stability of powders that are especially prone to caking. REOLOSIL can also be used to improve flow characteristics and prevent flow problems. Insulation: With its very low solid state conductivity and vast spacing between particles, REOLOSIL provides excellent electrical and thermal insulation properties. Electrical charge: Hydrophobic REOLOSIL is used as a toner additive to stabilize electrical charge characteristics. TOKUYAMA can provide hydrophobic REOLOSIL grades manufactured to custom specifications. Polishing: In the semiconductor manufacturing process, the planarizalion of silicon wafers is achieved via CMP (chemical mechanical polishing) processes such as ILD, STI and metal CMP. REOLOSIL is used in certain CMP slurries as a polishing agent, due to high purity, sub-micron particle size and its distribution characteristics.

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Reolosil QS-30

Fumed silica untreated Applications

Synthetic rubbers and Silicone rubbers: Reinforcing effect , Electrical insulation
Sealants: Thickening and thixotropy, Reinforcement, improved adhesion
Unsaturated polyester resins: Thickening and thixotropy
Paints / Coatings: Thickening and thixotropy, Storage stability (resistance to settlement)
Adhesives: Thickening and thixotropy, improved adhesion Storage stability (resistance to settlement)
Paper: Adsorbent, Transparency
Bulk materials: Anti-caking, free flow aids , Adsorbent, Anti-blocking effect, moisture resistance
CMP: Polishing agent
Toners: Improved flow properties, electric charge control, Improved toner transfer to paper

Characteristics Thickening and thixotropy: REOLOSIL provides thickening and thixotropic effects in liquid systems such as polyesters, epoxies, and urethane resins due to interactions between aggregates and the development of three-dimensional networks between REOLOSIL particles. Reinforcement: Adding REOLOSIL as a filler material improves various mechanical properties of elastomers, including modulus, elongation at break, tensile strength and tear resistance. REOLOSIL's large specific surface area also makes it possible to achieve excellent transparency in elastomers. Anti-settling effects: REOLOSIL improves the suspension behavior in liquid systems, such as pigmented coatings or resins containing filters. Anti-caking, effects for Improved flow characteristics: Due to a property that makes it behave like bait bearings, REOLOSIL resists lumping and clogging. It can be used to improve the storage stability of powders that are especially prone to caking. REOLOSIL can also be used to improve flow characteristics and prevent flow problems. Insulation: With its very low solid state conductivity and vast spacing between particles, REOLOSIL provides excellent electrical and thermal insulation properties. Electrical charge: Hydrophobic REOLOSIL is used as a toner additive to stabilize electrical charge characteristics. TOKUYAMA can provide hydrophobic REOLOSIL grades manufactured to custom specifications. Polishing: In the semiconductor manufacturing process, the planarizalion of silicon wafers is achieved via CMP (chemical mechanical polishing) processes such as ILD, STI and metal CMP. REOLOSIL is used in certain CMP slurries as a polishing agent, due to high purity, sub-micron particle size and its distribution characteristics.