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Pangel B10

Pangel B-10 is a powdered additive with a high thickening and anti-settling capacity for intermediate-low polarity systems, particularly recommended for systems based on white spirit type solvents.

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PANGEL B5 is a powdered additive with a high thickening and anti-settling capacity for low polarity systems, particularly recommended for systems based on both aliphatic solvents and mineral or synthetic oils used as vehicle in liquid formulations.

Properties

PANGEL B5 is particularly recommended to provide thixotropic, suspension and sagging-resistance properties to systems based on both aliphatic type solvents and mineral or synthetic oils. PANGEL B5 shows high thickening capacity in low polarity systems without the use of a polar activator for its dispersion. Use of PANGEL B5 has the following advantages against other conventional additives:

Decrease of sedimentation
High thickening capacity
Does not require polar activator
High capacity for thikening inverted emulsions
Control of sagging and dripping while improves stability.

Fields of application

Oil based concentrated formulations
Formulations based in inverted emulsions

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Pangel HV

PANGEL HV is a high efficiency rheological additive, manufactured from high purity sepiolite. Its presentation as a high porosity pellet avoids handling with powder, allowing for maximum efficiency. It is a rheological additive in the form of pellets, for a more convenient handling system.

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Pangel S9

PANGEL S9 is a highly efficient powder rheological additive manufactured from high purity sepiolite, for the use in aqueous systems. It is a powder additive that modifies the aqueous systems to which it is added.

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Reolosil QS 102

Fumed silica rheology additive Applications

Synthetic rubbers and Silicone rubbers: Reinforcing effect , Electrical insulation
Sealants: Thickening and thixotropy, Reinforcement, improved adhesion
Unsaturated polyester resins: Thickening and thixotropy
Paints / Coatings: Thickening and thixotropy, Storage stability (resistance to settlement)
Adhesives: Thickening and thixotropy, improved adhesion Storage stability (resistance to settlement)
Paper: Adsorbent, Transparency
Bulk materials: Anti-caking, free flow aids , Adsorbent, Anti-blocking effect, moisture resistance
CMP: Polishing agent
Toners: Improved flow properties, electric charge control, Improved toner transfer to paper

Characteristics Thickening and thixotropy: REOLOSIL provides thickening and thixotropic effects in liquid systems such as polyesters, epoxies, and urethane resins due to interactions between aggregates and the development of three-dimensional networks between REOLOSIL particles. Reinforcement: Adding REOLOSIL as a filler material improves various mechanical properties of elastomers, including modulus, elongation at break, tensile strength and tear resistance. REOLOSIL's large specific surface area also makes it possible to achieve excellent transparency in elastomers. Anti-settling effects: REOLOSIL improves the suspension behavior in liquid systems, such as pigmented coatings or resins containing filters. Anti-caking, effects for Improved flow characteristics: Due to a property that makes it behave like bait bearings, REOLOSIL resists lumping and clogging. It can be used to improve the storage stability of powders that are especially prone to caking. REOLOSIL can also be used to improve flow characteristics and prevent flow problems. Insulation: With its very low solid state conductivity and vast spacing between particles, REOLOSIL provides excellent electrical and thermal insulation properties. Electrical charge: Hydrophobic REOLOSIL is used as a toner additive to stabilize electrical charge characteristics. TOKUYAMA can provide hydrophobic REOLOSIL grades manufactured to custom specifications. Polishing: In the semiconductor manufacturing process, the planarizalion of silicon wafers is achieved via CMP (chemical mechanical polishing) processes such as ILD, STI and metal CMP. REOLOSIL is used in certain CMP slurries as a polishing agent, due to high purity, sub-micron particle size and its distribution characteristics.

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Reolosil DM 10

Fumed silica rheology additive, treated Applications

Synthetic rubbers and Silicone rubbers: Reinforcing effect , Electrical insulation
Sealants: Thickening and thixotropy, Reinforcement, improved adhesion
Unsaturated polyester resins: Thickening and thixotropy
Paints / Coatings: Thickening and thixotropy, Storage stability (resistance to settlement)
Adhesives: Thickening and thixotropy, improved adhesion Storage stability (resistance to settlement)
Paper: Adsorbent, Transparency
Bulk materials: Anti-caking, free flow aids , Adsorbent, Anti-blocking effect, moisture resistance
CMP: Polishing agent
Toners: Improved flow properties, electric charge control, Improved toner transfer to paper

Characteristics Thickening and thixotropy: REOLOSIL provides thickening and thixotropic effects in liquid systems such as polyesters, epoxies, and urethane resins due to interactions between aggregates and the development of three-dimensional networks between REOLOSIL particles. Reinforcement: Adding REOLOSIL as a filler material improves various mechanical properties of elastomers, including modulus, elongation at break, tensile strength and tear resistance. REOLOSIL's large specific surface area also makes it possible to achieve excellent transparency in elastomers. Anti-settling effects: REOLOSIL improves the suspension behavior in liquid systems, such as pigmented coatings or resins containing filters. Anti-caking, effects for Improved flow characteristics: Due to a property that makes it behave like bait bearings, REOLOSIL resists lumping and clogging. It can be used to improve the storage stability of powders that are especially prone to caking. REOLOSIL can also be used to improve flow characteristics and prevent flow problems. Insulation: With its very low solid state conductivity and vast spacing between particles, REOLOSIL provides excellent electrical and thermal insulation properties. Electrical charge: Hydrophobic REOLOSIL is used as a toner additive to stabilize electrical charge characteristics. TOKUYAMA can provide hydrophobic REOLOSIL grades manufactured to custom specifications. Polishing: In the semiconductor manufacturing process, the planarizalion of silicon wafers is achieved via CMP (chemical mechanical polishing) processes such as ILD, STI and metal CMP. REOLOSIL is used in certain CMP slurries as a polishing agent, due to high purity, sub-micron particle size and its distribution characteristics.

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Viscoclyn AS 33

Thickner for alcohol solutions.

Stiff Gel after neutralization
Easy to mix and disperse
Pumpable and pourable without runoff
Stable with other inert additives such as fragrances
Can make gels comparable to commercial products

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Reolosil QS-20

Fumed silica, untreated Applications

Synthetic rubbers and Silicone rubbers: Reinforcing effect , Electrical insulation
Sealants: Thickening and thixotropy, Reinforcement, improved adhesion
Unsaturated polyester resins: Thickening and thixotropy
Paints / Coatings: Thickening and thixotropy, Storage stability (resistance to settlement)
Adhesives: Thickening and thixotropy, improved adhesion Storage stability (resistance to settlement)
Paper: Adsorbent, Transparency
Bulk materials: Anti-caking, free flow aids , Adsorbent, Anti-blocking effect, moisture resistance
CMP: Polishing agent
Toners: Improved flow properties, electric charge control, Improved toner transfer to paper

Characteristics Thickening and thixotropy: REOLOSIL provides thickening and thixotropic effects in liquid systems such as polyesters, epoxies, and urethane resins due to interactions between aggregates and the development of three-dimensional networks between REOLOSIL particles. Reinforcement: Adding REOLOSIL as a filler material improves various mechanical properties of elastomers, including modulus, elongation at break, tensile strength and tear resistance. REOLOSIL's large specific surface area also makes it possible to achieve excellent transparency in elastomers. Anti-settling effects: REOLOSIL improves the suspension behavior in liquid systems, such as pigmented coatings or resins containing filters. Anti-caking, effects for Improved flow characteristics: Due to a property that makes it behave like bait bearings, REOLOSIL resists lumping and clogging. It can be used to improve the storage stability of powders that are especially prone to caking. REOLOSIL can also be used to improve flow characteristics and prevent flow problems. Insulation: With its very low solid state conductivity and vast spacing between particles, REOLOSIL provides excellent electrical and thermal insulation properties. Electrical charge: Hydrophobic REOLOSIL is used as a toner additive to stabilize electrical charge characteristics. TOKUYAMA can provide hydrophobic REOLOSIL grades manufactured to custom specifications. Polishing: In the semiconductor manufacturing process, the planarizalion of silicon wafers is achieved via CMP (chemical mechanical polishing) processes such as ILD, STI and metal CMP. REOLOSIL is used in certain CMP slurries as a polishing agent, due to high purity, sub-micron particle size and its distribution characteristics.

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Reolosil QS-30

Fumed silica untreated Applications

Synthetic rubbers and Silicone rubbers: Reinforcing effect , Electrical insulation
Sealants: Thickening and thixotropy, Reinforcement, improved adhesion
Unsaturated polyester resins: Thickening and thixotropy
Paints / Coatings: Thickening and thixotropy, Storage stability (resistance to settlement)
Adhesives: Thickening and thixotropy, improved adhesion Storage stability (resistance to settlement)
Paper: Adsorbent, Transparency
Bulk materials: Anti-caking, free flow aids , Adsorbent, Anti-blocking effect, moisture resistance
CMP: Polishing agent
Toners: Improved flow properties, electric charge control, Improved toner transfer to paper

Characteristics Thickening and thixotropy: REOLOSIL provides thickening and thixotropic effects in liquid systems such as polyesters, epoxies, and urethane resins due to interactions between aggregates and the development of three-dimensional networks between REOLOSIL particles. Reinforcement: Adding REOLOSIL as a filler material improves various mechanical properties of elastomers, including modulus, elongation at break, tensile strength and tear resistance. REOLOSIL's large specific surface area also makes it possible to achieve excellent transparency in elastomers. Anti-settling effects: REOLOSIL improves the suspension behavior in liquid systems, such as pigmented coatings or resins containing filters. Anti-caking, effects for Improved flow characteristics: Due to a property that makes it behave like bait bearings, REOLOSIL resists lumping and clogging. It can be used to improve the storage stability of powders that are especially prone to caking. REOLOSIL can also be used to improve flow characteristics and prevent flow problems. Insulation: With its very low solid state conductivity and vast spacing between particles, REOLOSIL provides excellent electrical and thermal insulation properties. Electrical charge: Hydrophobic REOLOSIL is used as a toner additive to stabilize electrical charge characteristics. TOKUYAMA can provide hydrophobic REOLOSIL grades manufactured to custom specifications. Polishing: In the semiconductor manufacturing process, the planarizalion of silicon wafers is achieved via CMP (chemical mechanical polishing) processes such as ILD, STI and metal CMP. REOLOSIL is used in certain CMP slurries as a polishing agent, due to high purity, sub-micron particle size and its distribution characteristics.

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Reolosil QS-40

Fumed silica matting agent Applications

Synthetic rubbers and Silicone rubbers: Reinforcing effect , Electrical insulation
Sealants: Thickening and thixotropy, Reinforcement, improved adhesion
Unsaturated polyester resins: Thickening and thixotropy
Paints / Coatings: Thickening and thixotropy, Storage stability (resistance to settlement)
Adhesives: Thickening and thixotropy, improved adhesion Storage stability (resistance to settlement)
Paper: Adsorbent, Transparency
Bulk materials: Anti-caking, free flow aids , Adsorbent, Anti-blocking effect, moisture resistance
CMP: Polishing agent
Toners: Improved flow properties, electric charge control, Improved toner transfer to paper

Characteristics Thickening and thixotropy: REOLOSIL provides thickening and thixotropic effects in liquid systems such as polyesters, epoxies, and urethane resins due to interactions between aggregates and the development of three-dimensional networks between REOLOSIL particles. Reinforcement: Adding REOLOSIL as a filler material improves various mechanical properties of elastomers, including modulus, elongation at break, tensile strength and tear resistance. REOLOSIL's large specific surface area also makes it possible to achieve excellent transparency in elastomers. Anti-settling effects: REOLOSIL improves the suspension behavior in liquid systems, such as pigmented coatings or resins containing filters. Anti-caking, effects for Improved flow characteristics: Due to a property that makes it behave like bait bearings, REOLOSIL resists lumping and clogging. It can be used to improve the storage stability of powders that are especially prone to caking. REOLOSIL can also be used to improve flow characteristics and prevent flow problems. Insulation: With its very low solid state conductivity and vast spacing between particles, REOLOSIL provides excellent electrical and thermal insulation properties. Electrical charge: Hydrophobic REOLOSIL is used as a toner additive to stabilize electrical charge characteristics. TOKUYAMA can provide hydrophobic REOLOSIL grades manufactured to custom specifications. Polishing: In the semiconductor manufacturing process, the planarizalion of silicon wafers is achieved via CMP (chemical mechanical polishing) processes such as ILD, STI and metal CMP. REOLOSIL is used in certain CMP slurries as a polishing agent, due to high purity, sub-micron particle size and its distribution characteristics.

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Reolosil PM-20

Fumed silica, treated, rheology additive Applications

Synthetic rubbers and Silicone rubbers: Reinforcing effect , Electrical insulation
Sealants: Thickening and thixotropy, Reinforcement, improved adhesion
Unsaturated polyester resins: Thickening and thixotropy
Paints / Coatings: Thickening and thixotropy, Storage stability (resistance to settlement)
Adhesives: Thickening and thixotropy, improved adhesion Storage stability (resistance to settlement)
Paper: Adsorbent, Transparency
Bulk materials: Anti-caking, free flow aids , Adsorbent, Anti-blocking effect, moisture resistance
CMP: Polishing agent
Toners: Improved flow properties, electric charge control, Improved toner transfer to paper

Characteristics Thickening and thixotropy: REOLOSIL provides thickening and thixotropic effects in liquid systems such as polyesters, epoxies, and urethane resins due to interactions between aggregates and the development of three-dimensional networks between REOLOSIL particles. Reinforcement: Adding REOLOSIL as a filler material improves various mechanical properties of elastomers, including modulus, elongation at break, tensile strength and tear resistance. REOLOSIL's large specific surface area also makes it possible to achieve excellent transparency in elastomers. Anti-settling effects: REOLOSIL improves the suspension behavior in liquid systems, such as pigmented coatings or resins containing filters. Anti-caking, effects for Improved flow characteristics: Due to a property that makes it behave like bait bearings, REOLOSIL resists lumping and clogging. It can be used to improve the storage stability of powders that are especially prone to caking. REOLOSIL can also be used to improve flow characteristics and prevent flow problems. Insulation: With its very low solid state conductivity and vast spacing between particles, REOLOSIL provides excellent electrical and thermal insulation properties. Electrical charge: Hydrophobic REOLOSIL is used as a toner additive to stabilize electrical charge characteristics. TOKUYAMA can provide hydrophobic REOLOSIL grades manufactured to custom specifications. Polishing: In the semiconductor manufacturing process, the planarizalion of silicon wafers is achieved via CMP (chemical mechanical polishing) processes such as ILD, STI and metal CMP. REOLOSIL is used in certain CMP slurries as a polishing agent, due to high purity, sub-micron particle size and its distribution characteristics.

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Pangel B42

Pangel B-42 is a powdered additive with a high thickening and anti-settling capacity for high polarity systems, particularly recommended for systems based on alcohol, glycol an ketone type solvents, as well as in mixtures of those with water. Pangel B-42 is particularly recommended to provide thixotropic, suspension and sagging-resistance properties to systems based on alcohol, glycol an ketone type solvents, as well as in mixtures of those with water. Pangel B-42 provides a strongly pseudoplastic character, producing high consistency levels without affecting viscosity during application. It exhibits its high effectiveness as anti-settling additive in formulations with high solid contents. Use of Pangel B-42 has the following advantages against other conventional additives: • Coatings and paints- Prevents settling of pigments and fillers; controls sagging without aggravating leveling; high stability during transportation and storage. • Printing inks: Improves consistency and prevents settling of pigments. • Paint strippers: Improves stability and facilitates stripping action. • Sealants and joints: Improves wetting and suspension properties; controls sliding. • Others: Control of sagging and dripping; improves stability.