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  • Cardolite NT-1515is a solvent free, high viscosity polyamide designed for use with solid or liquid epoxy resins. NT-1515 epoxy systems can be used in maintenance coatings, primers and enamel paint formulations because of their excellent corrosion resistance and adhesion properties. This product is also useful in adhesive applications.
  • Cardolite NT-1515X70 is a xylene solution of a high viscosity polyamide, designed for use with solid or liquid epoxy resins. NT-1515X70 epoxy resin systems are used in maintenance coatings and primers because of their excellent corrosion resistance and adhesion properties. This product is also useful in adhesive applications.
  • Cardolite NT-3000 is an aliphatic monoglycidyl ether containing alkyl chains,which are predominately C12 and C14 in length.
  • Cardolite Ultra LITE 2020is a low viscosity, solvent-free multipurpose resin modifier designed for use in coatings, adhesives, and other applications. The long hydrophobic aliphatic side chain of the cardanol molecule gives this product a very low viscosity and provides excellent early water resistance and corrosion protection. Used as an epoxy diluent, high viscosity solvent or solvent free formulations can achieve enhanced workability and higher solids without sacrificing other performance properties using this product. This product also has the ability to react and be used in alkyds, urethanes, and acrylics. Cardolite UltraLITE 2020 was designed as a formulation tool to reduce VOC levels and viscosity of coating and adhesive systems. Although higher in viscosity than some other modifiers, the structure of this product gives excellent dilution efficiency to help rapidly reduce viscosity for improved pigment wetting, flexibility, and general application properties. Physical properties such as water resistance, corrosion protection, color stability, chemical resistance, and gloss are not significantly compromised with the addition of Ultra LITE 2020, and the product can be added in on either component side of multi-part formulations. ADVANTAGES • Lowers viscosity while maintaining performance • Preserves chemical and water resistance • Good dilution effect • Adds flexibility • Reduces high shear • Compatible and usable in a variety of coating chemistries•Improves pigment wetting • Reacts with urethanes, alkyds, and acrylic resin • Low volatility and high flash point • Non-toxic • Based from natural, renewable,non-food raw material feedstock
  • Precipitated silica Carrier, Free Flow Agent Food, battery separator Over 20 products ranging from 6 microns to 21 microns For food applications OSC has Halal certification and Kosher certification. Application examples: Food and Feed: Seasonings, Spices, Herbs, Sugar, Salt, Mineral mixes and Limestone Agrochemicals: Wettable powders Characteristics: Good flowability and anti-caking behavior of the milled powder
    • reduces the caking of low melting powders.
    • absorbs promptly any released liquid.
    • avoids clogging of the mill and decreases the shutdown times.
    • improves the free fl owing and anti-caking properties.
    • reduces time and cost consuming maintenance intervals.
    • increases the throughput by longer operation times.
     
  • Precipitated silica Carrier, Free Flow Agent Food, battery separator Over 20 products ranging from 6 microns to 21 microns For food applications OSC has Halal certification and Kosher certification. Application examples: Food and Feed: Seasonings, Spices, Herbs, Sugar, Salt, Mineral mixes and Limestone Agrochemicals: Wettable powders Characteristics: Good flowability and anti-caking behavior of the milled powder
    • reduces the caking of low melting powders.
    • absorbs promptly any released liquid.
    • avoids clogging of the mill and decreases the shutdown times.
    • improves the free fl owing and anti-caking properties.
    • reduces time and cost consuming maintenance intervals.
    • increases the throughput by longer operation times.
     
  • Fumed silica, untreated Applications
    • Synthetic rubbers and Silicone rubbers: Reinforcing effect , Electrical insulation
    • Sealants: Thickening and thixotropy, Reinforcement, improved adhesion
    • Unsaturated polyester resins: Thickening and thixotropy
    • Paints / Coatings: Thickening and thixotropy, Storage stability (resistance to settlement)
    • Adhesives: Thickening and thixotropy, improved adhesion Storage stability (resistance to settlement)
    • Paper: Adsorbent, Transparency
    • Bulk materials: Anti-caking, free flow aids , Adsorbent, Anti-blocking effect, moisture resistance
    • CMP: Polishing agent
    • Toners: Improved flow properties, electric charge control, Improved toner transfer to paper
    Characteristics Thickening and thixotropy: REOLOSIL provides thickening and thixotropic effects in liquid systems such as polyesters, epoxies, and urethane resins due to interactions between aggregates and the development of three-dimensional networks between REOLOSIL particles. Reinforcement: Adding REOLOSIL as a filler material improves various mechanical properties of elastomers, including modulus, elongation at break, tensile strength and tear resistance. REOLOSIL's large specific surface area also makes it possible to achieve excellent transparency in elastomers. Anti-settling effects: REOLOSIL improves the suspension behavior in liquid systems, such as pigmented coatings or resins containing filters. Anti-caking, effects for Improved flow characteristics: Due to a property that makes it behave like bait bearings, REOLOSIL resists lumping and clogging. It can be used to improve the storage stability of powders that are especially prone to caking. REOLOSIL can also be used to improve flow characteristics and prevent flow problems. Insulation: With its very low solid state conductivity and vast spacing between particles, REOLOSIL provides excellent electrical and thermal insulation properties. Electrical charge: Hydrophobic REOLOSIL is used as a toner additive to stabilize electrical charge characteristics. TOKUYAMA can provide hydrophobic REOLOSIL grades manufactured to custom specifications. Polishing: In the semiconductor manufacturing process, the planarizalion of silicon wafers is achieved via CMP (chemical mechanical polishing) processes such as ILD, STI and metal CMP. REOLOSIL is used in certain CMP slurries as a polishing agent, due to high purity, sub-micron particle size and its distribution characteristics.    
  • Fumed silica untreated Applications
    • Synthetic rubbers and Silicone rubbers: Reinforcing effect , Electrical insulation
    • Sealants: Thickening and thixotropy, Reinforcement, improved adhesion
    • Unsaturated polyester resins: Thickening and thixotropy
    • Paints / Coatings: Thickening and thixotropy, Storage stability (resistance to settlement)
    • Adhesives: Thickening and thixotropy, improved adhesion Storage stability (resistance to settlement)
    • Paper: Adsorbent, Transparency
    • Bulk materials: Anti-caking, free flow aids , Adsorbent, Anti-blocking effect, moisture resistance
    • CMP: Polishing agent
    • Toners: Improved flow properties, electric charge control, Improved toner transfer to paper
    Characteristics Thickening and thixotropy: REOLOSIL provides thickening and thixotropic effects in liquid systems such as polyesters, epoxies, and urethane resins due to interactions between aggregates and the development of three-dimensional networks between REOLOSIL particles. Reinforcement: Adding REOLOSIL as a filler material improves various mechanical properties of elastomers, including modulus, elongation at break, tensile strength and tear resistance. REOLOSIL's large specific surface area also makes it possible to achieve excellent transparency in elastomers. Anti-settling effects: REOLOSIL improves the suspension behavior in liquid systems, such as pigmented coatings or resins containing filters. Anti-caking, effects for Improved flow characteristics: Due to a property that makes it behave like bait bearings, REOLOSIL resists lumping and clogging. It can be used to improve the storage stability of powders that are especially prone to caking. REOLOSIL can also be used to improve flow characteristics and prevent flow problems. Insulation: With its very low solid state conductivity and vast spacing between particles, REOLOSIL provides excellent electrical and thermal insulation properties. Electrical charge: Hydrophobic REOLOSIL is used as a toner additive to stabilize electrical charge characteristics. TOKUYAMA can provide hydrophobic REOLOSIL grades manufactured to custom specifications. Polishing: In the semiconductor manufacturing process, the planarizalion of silicon wafers is achieved via CMP (chemical mechanical polishing) processes such as ILD, STI and metal CMP. REOLOSIL is used in certain CMP slurries as a polishing agent, due to high purity, sub-micron particle size and its distribution characteristics.    
  • Fumed silica matting agent Applications
    • Synthetic rubbers and Silicone rubbers: Reinforcing effect , Electrical insulation
    • Sealants: Thickening and thixotropy, Reinforcement, improved adhesion
    • Unsaturated polyester resins: Thickening and thixotropy
    • Paints / Coatings: Thickening and thixotropy, Storage stability (resistance to settlement)
    • Adhesives: Thickening and thixotropy, improved adhesion Storage stability (resistance to settlement)
    • Paper: Adsorbent, Transparency
    • Bulk materials: Anti-caking, free flow aids , Adsorbent, Anti-blocking effect, moisture resistance
    • CMP: Polishing agent
    • Toners: Improved flow properties, electric charge control, Improved toner transfer to paper
    Characteristics Thickening and thixotropy: REOLOSIL provides thickening and thixotropic effects in liquid systems such as polyesters, epoxies, and urethane resins due to interactions between aggregates and the development of three-dimensional networks between REOLOSIL particles. Reinforcement: Adding REOLOSIL as a filler material improves various mechanical properties of elastomers, including modulus, elongation at break, tensile strength and tear resistance. REOLOSIL's large specific surface area also makes it possible to achieve excellent transparency in elastomers. Anti-settling effects: REOLOSIL improves the suspension behavior in liquid systems, such as pigmented coatings or resins containing filters. Anti-caking, effects for Improved flow characteristics: Due to a property that makes it behave like bait bearings, REOLOSIL resists lumping and clogging. It can be used to improve the storage stability of powders that are especially prone to caking. REOLOSIL can also be used to improve flow characteristics and prevent flow problems. Insulation: With its very low solid state conductivity and vast spacing between particles, REOLOSIL provides excellent electrical and thermal insulation properties. Electrical charge: Hydrophobic REOLOSIL is used as a toner additive to stabilize electrical charge characteristics. TOKUYAMA can provide hydrophobic REOLOSIL grades manufactured to custom specifications. Polishing: In the semiconductor manufacturing process, the planarizalion of silicon wafers is achieved via CMP (chemical mechanical polishing) processes such as ILD, STI and metal CMP. REOLOSIL is used in certain CMP slurries as a polishing agent, due to high purity, sub-micron particle size and its distribution characteristics.    
  • Fumed silica, treated, rheology additive Applications
    • Synthetic rubbers and Silicone rubbers: Reinforcing effect , Electrical insulation
    • Sealants: Thickening and thixotropy, Reinforcement, improved adhesion
    • Unsaturated polyester resins: Thickening and thixotropy
    • Paints / Coatings: Thickening and thixotropy, Storage stability (resistance to settlement)
    • Adhesives: Thickening and thixotropy, improved adhesion Storage stability (resistance to settlement)
    • Paper: Adsorbent, Transparency
    • Bulk materials: Anti-caking, free flow aids , Adsorbent, Anti-blocking effect, moisture resistance
    • CMP: Polishing agent
    • Toners: Improved flow properties, electric charge control, Improved toner transfer to paper
    Characteristics Thickening and thixotropy: REOLOSIL provides thickening and thixotropic effects in liquid systems such as polyesters, epoxies, and urethane resins due to interactions between aggregates and the development of three-dimensional networks between REOLOSIL particles. Reinforcement: Adding REOLOSIL as a filler material improves various mechanical properties of elastomers, including modulus, elongation at break, tensile strength and tear resistance. REOLOSIL's large specific surface area also makes it possible to achieve excellent transparency in elastomers. Anti-settling effects: REOLOSIL improves the suspension behavior in liquid systems, such as pigmented coatings or resins containing filters. Anti-caking, effects for Improved flow characteristics: Due to a property that makes it behave like bait bearings, REOLOSIL resists lumping and clogging. It can be used to improve the storage stability of powders that are especially prone to caking. REOLOSIL can also be used to improve flow characteristics and prevent flow problems. Insulation: With its very low solid state conductivity and vast spacing between particles, REOLOSIL provides excellent electrical and thermal insulation properties. Electrical charge: Hydrophobic REOLOSIL is used as a toner additive to stabilize electrical charge characteristics. TOKUYAMA can provide hydrophobic REOLOSIL grades manufactured to custom specifications. Polishing: In the semiconductor manufacturing process, the planarizalion of silicon wafers is achieved via CMP (chemical mechanical polishing) processes such as ILD, STI and metal CMP. REOLOSIL is used in certain CMP slurries as a polishing agent, due to high purity, sub-micron particle size and its distribution characteristics.    
  • NexSil 8 is an alkaline dispersion of 8 nm colloidal silica at 30% SiO2 concentration in water. The particles are negatively charged and have a high specific surface area. The product can be used in a wide variety of applications such as precision investment casting, metal surface treatment, textile treatment, catalyst binder or other applications where a very small particle size colloidal silica is required.
  • NexSil 12 is an alkaline dispersion of 12 nm colloidal silica at 30% SiO2 concentration in water. The particles are negatively charged and have a high specific surface area. The product can be used in a wide variety of applications such as precision investment casting, precision polishing, metal surface treatment, textile treatment, catalyst binder or other applications where a very small particle size colloidal silica is required.